The semiconductor manufacturing process mainly includes the following steps:

Wafer preparation: Single crystal silicon is extracted from high-purity silicon, cut into wafers, and cleaned and polished to ensure a smooth surface.

Oxidation: Forming a thin layer of silicon dioxide on the wafer surface that acts as an insulating layer.

Photolithography: Transferring circuit patterns onto a wafer using photolithography technology.

Etching: Removing unwanted material to reveal circuit patterns.

Doping and ion implantation: Impurity atoms are introduced into the silicon wafer to form semiconductor properties such as PN junctions.

Metal interconnect: depositing metal layers on the wafer to form electrical connections.

Packaging and testing: Packaging and reliability testing of the final device.

Together, these steps make up the semiconductor manufacturing process, confirming the performance and reliability of the final product.