Semiconductor process equipment is the core tool for chip manufacturing, covering key links such as photolithography, etching, cleaning, thin film deposition, and doping, which directly affects chip performance, power consumption, and yield.

The core link of process equipment

1. Wafer preparation equipment
   Wafers are the basis of chips and are typically made of high-purity silicon. Preparation equipment includes single crystal silicon pulling machines, slicing machines and polishing machines to obtain high-precision, defect-free silicon wafers.
2. Lithography and etching equipment
   • Lithography machine: Transferring circuit patterns onto silicon wafers is a critical step in forming transistors and interconnect structures.
   • Etching machine: Divided into dry etching (plasma etching, suitable for Si3N4, polysilicon, metals, etc.) and wet etching (chemical etching, suitable for SiO2 and some metals).
3. Thin film deposition and doping equipment
   • Thin film deposition machine: Used to form conductive or insulating layers on silicon wafers, including CVD, PVD and other technologies.
   • Doping equipment: By injecting impurity elements, the conductive properties of the silicon wafer are changed and the transistor characteristics are controlled.
4. Cleaning and degumming equipment
   Wet cleaning equipment is used to remove residues and photoresist on the wafer surface to ensure subsequent process accuracy. Typical equipment includes tank-type wet etching cleaning machines, glue removers, evaporation mask cleaning machines, etc.
5. Measuring and testing equipment
   The online inspection system can monitor the chemical concentration, film thickness and wafer surface defects to ensure process stability and yield.