2026/6/18
●Today’s semiconductor industry has become one of the indispensable pillars of modern society. From computers, to smartphones, to artificial intelligence, almost all technological fields are inseparable from the application of chips.
It is in this highly competitive market that chip manufacturers have been working hard to improve chip performance. On the one hand, they continue to break through physical limits in the chip manufacturing process; on the other hand, they develop new processes in design, packaging and other aspects. However, as chip size continues to shrink, the impact of tiny impurities and contaminants on chip yield and performance begins to become more and more significant.
Semiconductor cleaning, as a basic process that runs through silicon wafer manufacturing, wafer manufacturing, packaging and other links, has also begun to develop in the direction of refinement and specialization.
It is worth mentioning that in recent years, domestic semiconductor cleaning equipment has been continuously improved, and it is one of the categories with a high domesticization rate in semiconductor equipment.
According to reports, judging from the current situation of the industry, the main cleaning equipment and auxiliary equipment of most domestic enterprises are generally provided by different suppliers, and Flat can provide both hardware and supporting software.
Therefore, for customers, whether it is early evaluation costs, later operating costs, or overall procurement costs, "one-stop procurement" can save a lot of costs and achieve cost reduction and efficiency improvement for the enterprise.
From the perspective of the global environment, the semiconductor cleaning equipment market is mainly dominated by Japan's Deans, Tokyo Electronics, SMC and Lam Semiconductor. The total market share of the four companies has reached more than 90%, and the market structure is relatively concentrated.
However, since the cleaning equipment itself does not occupy a large cost space and is relatively less complex than etching equipment, thin film deposition equipment and other categories, it is also one of the categories with the greatest possibility of localization.
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