Semiconductor wet process equipment is a general term for equipment that uses liquid chemical solvents to perform key processes such as cleaning, etching and polishing in chip manufacturing, which directly determines the yield and performance of the chip. This type of equipment uses chemical solutions and deionized water to remove particles, metal impurities and oxide layers on the wafer surface. It is a core link throughout the entire process from silicon wafer manufacturing to packaging and testing.

Wet equipment relies primarily on chemical reactions to "sweep" or "carve" the wafer surface, complementing dry equipment (using gas plasma). ‌‌Encyclopedia

1. ‌Core principle‌: Use liquid chemical reagents (such as acids, alkalis, solvents) to react with materials to dissolve or corrode away unnecessary parts. ‌‌
2. ‌Main functions‌:
   • ‌Cleaning‌: Removing particles, organic matter, metal contamination, etc., accounting for more than ‌90%‌ of the cleaning steps in chip manufacturing, and is absolutely mainstream.
   • ‌Etching‌: Pattern transfer is achieved through etching. Although it is partially replaced by dry methods in advanced processes, it is still irreplaceable in specific material processing.
   • ‌Polishing‌: Chemical mechanical polishing (CMP), used to planarize the wafer surface. ‌‌Encyclopedia‌
3. ‌Application Scope‌: Not only used in logic chip and memory chip manufacturing, but also widely used in compound semiconductors (such as GaN, SiC), MEMS devices and advanced packaging fields